Recently, China's first wafer-level "Plasma Multi-Drive Dissociation Etching Equipment", launched by Zhuhai Hengge Microelectronics Equipment Co., Ltd. (hereinafter referred to as "Hengge Microelectronics"), was unveiled in Zhuhai National Hi-Tech Industrial Development Zone. The successful launch of this equipment marks a major technological breakthrough in China's high-end semiconductor manufacturing core equipment sector, injecting strong momentum into the localized replacement of chip manufacturing.
According to Li Zhiqiang, General Manager of Hengge Microelectronics, the plasma multi-drive dissociation technology is the result of Hengge Microelectronics' decade-long R&D efforts. Currently, it has passed verification by leading wafer fabs and entered the mass production and delivery phase. In the future, the company will continue to increase R&D investment to build a semiconductor equipment matrix covering all links such as etching and thin-film deposition.
Independent Innovation to Break Monopoly
Breakthroughs in Core Technologies
This wafer-level "Plasma Multi-Drive Dissociation Etching Equipment" was developed by Hengge Microelectronics after over three years of technological research. The equipment has overcome a number of "chokepoint" technical challenges, featuring high efficiency, high uniformity, and high compatibility. It can be widely used in integrated circuits, third-generation semiconductors, and advanced packaging fields, meeting the manufacturing needs of 8-inch to 12-inch wafers. Its core process indicators have reached the international advanced level, filling the gap in domestic high-end etching equipment. This will significantly reduce wafer fabs' reliance on imported equipment and contribute to the security upgrade of the semiconductor industry chain.
Xue Fei, Member of the Party Working Committee and Deputy Director of the Management Committee of Zhuhai National Hi-Tech Industrial Development Zone, stated that Hengge Microelectronics has grown from a leader in the PCB equipment segment to a new force in semiconductor equipment, fully demonstrating the innovative resilience and responsibility of Zhuhai's hard tech enterprises. He expressed hope that Hengge Microelectronics will continue to deepen technological R&D and contribute to the development of the Guangdong-Hong Kong-Macao Greater Bay Area as a highland for the semiconductor industry.
Industry-University-Research Collaboration
Building an Industry Chain Ecosystem Together
At the launch event, Hengge Microelectronics signed a in-depth industry-university-research cooperation agreement with the National Key Laboratory of Electronic Thin Films and Integrated Devices. The two parties will carry out strategic cooperation in areas such as core technology R&D of semiconductor equipment and professional talent cultivation, accelerating the transformation of university research achievements and providing intellectual support for the technological iteration of domestic semiconductor equipment.
Meanwhile, Hengge Microelectronics reached a process cooperation and development agreement with a leading domestic display panel enterprise. The two parties will conduct joint R&D targeting the etching process needs in display panel manufacturing, promoting the large-scale application of domestic plasma etching equipment in the display field and accelerating the localization replacement process of core equipment in the panel industry. Additionally, a strategic cooperation was established with San Dieji Company, focusing on the iterative R&D and industrial application of TGV-plasma etching equipment to contribute to domestic equipment development.
Setting Sail from Zhuhai
Marching Towards the Globe
Founded in 2005, Hengge Microelectronics has been deeply engaged in the plasma technology field for nearly 20 years, and its PCB plasma cleaning equipment has maintained a leading domestic market share. In recent years, Hengge Microelectronics has targeted the semiconductor equipment track, focusing on the R&D of core etching equipment technologies, and gradually built a full industrial chain capability covering R&D, manufacturing, and services. The newly launched product is a key step in its transformation to the high-end semiconductor equipment field.
After the launch event, the attending guests visited Hengge Microelectronics' manufacturing base to observe the equipment production line and process demonstration up close.
In the future, driven by technological innovation, Hengge Microelectronics will join hands with industrial chain partners to help China's semiconductor equipment move towards high-endization and internationalization.
Extended Reading
For a long time, Zhuhai National Hi-Tech Industrial Development Zone has regarded the integrated circuit industry as the leading industry driving regional innovative development. It focuses on strengthening, extending, and supplementing the industrial chain in fields such as high-end semiconductor design, equipment manufacturing, wafer foundry, and advanced packaging, promoting the clustered development of the semiconductor and integrated circuit industry. A complete industrial chain system covering "design-manufacturing-packaging-testing" has been initially formed.
The number of semiconductor and integrated circuit enterprises and their economic scale rank first in Zhuhai. In 2024, the scale of designated (above-scale) enterprises reached 10.662 billion yuan, with an average annual growth rate of over 20% in the past five years. It has become the main hub for the development of Zhuhai's integrated circuit industry.
Going forward, Zhuhai National Hi-Tech Industrial Development Zone will continue to provide the best policy support, the best carrier supporting facilities, the best business environment, and the best talent ecosystem to help enterprises build more benchmark brands in the integrated circuit industry.
